The single-crystal silicon ultrasonic cleaning machine is a kind of cleaning equipment used for cleaning the crystal silicon wafers and other precision objects. The single-crystal silicon wafers cut from the crystal rods are processed by chamfering, double-sided grinding, polishing, and other processes, it's got all kinds of contaminants on its surface. With the increasing quality requirement of IC, the contamination on the surface of the silicon wafer is strictly controlled. If the single crystal silicon chip is not cleaned, the quality and yield of the device will be seriously affected. Cleaning also becomes an important step in the process of manufacturing single crystal silicon chips.
Single crystal silicon ultrasonic cleaning machine is through the ultrasonic vibration in the liquid to form tiny bubbles, these bubbles are quickly ruptured by ultrasonic cavitation, resulting in tiny scrubbings to remove contaminants from the surface of the silicon wafer. Ultrasonic cleaning technology has been widely used in the semiconductor industry as a cleaning method. It has the advantages of a good cleaning effect and simple operation. Most of the steps in the process of making single crystal silicon wafers are the cleaning process. The ultrasonic cleaning machine for single crystal silicon wafers should be used correctly in cleaning the silicon wafers, the cleanliness of a single crystal silicon chip is critical to the performance of the semiconductor device.
