Since its inception, ultrasonic cleaning technology has received a widespread application in industries such as electronics, machinery, hardware, optical components, surface treatment, instruments, and semiconductor industries. The use of ultrasonic cleaning technology, known as brushless cleaning technology, has greatly improved work efficiency and cleaning effect. In the past, the existence of cleaning dead ends, blind holes, and difficult hidden dirt on the workpiece have always made people feel at a loss, and the development and application of ultrasonic cleaning make this work easier. In the application process of ultrasonic cleaning technology, the lack of low frequency (less than 50kHz) ultrasonic waves gradually appears. For example, when the high-frequency ultrasonic is high -time, it is easy to cause air front corrosion of the workpiece surface, and it is not suitable for high surface smoothness. In addition, low-frequency ultrasonic cleaning on the mechanical parameter performance of micro -electromagnetic relays will have adverse effects, resulting in the changes in mechanical parameters of relays. These insufficient restrictions on the cleaning of low-frequency ultrasonic cleaning technology with electrical contacts inside or PCB assembly equipped with such electronic components. The continuous development and maturity of high-frequency ultrasonic technology, have laid a solid foundation for applications on the application of electrical contacts in the interior of the ultrasonic cleaning in the interior of the relay.
The definition of high-frequency ultrasonic is equivalent to low frequency. Generally, ultrasonic frequency below 50kHz is called low frequency. This frequency band is currently the most widely used in industrial-grade ultrasonic cleaning. The common frequency includes 28kHz and 40kHz. The ultrasonic frequency can be called high frequency in (51-199) KHz, and the common frequency includes 80kHz, 120kHz, and 170kHz.
In the field of precision cleaning, it is necessary to obtain a good cleaning effect on tiny excess objects. It is generally believed that the following key elements need to be controlled, including 1) the selection of cleaning agents; 2) ultrasonic frequency and power; 3) cleaning temperature; 4 ) Cleaning time. The cleaning effect of the cleaning time is a key factor for the workpiece. The cleaning time is too short, and the excess of the workpiece surface cannot be completely removed; the cleaning time is too long, and the surface of the workpiece will be contaminated due to the cumulative effect of soaking.
For a long time, due to the shortcomings of low-frequency ultrasonic cleaning, such as the excessive cleaning time, the surface of the workpiece with high cleanliness has been empty and corrosive, which has caused certain limitations in the application of micro -electromagnetic relay. However, with the emergence of high-frequency ultrasonic cleaning technology, while achieving a good cleaning effect, it also effectively eliminates the damage to the surface of the workpiece. Through the research on the feasibility and application process parameters of high-frequency ultrasonic cleaning technology on miniature electrical relays, it can be considered that high-frequency ultrasonic cleaning technology is used in the cleaning application of electromagnetic relays (including micro -electromagnetic relays). 15 & mu; m below) extensive application prospects.
